Molex showcased its high-speed data connectivity solutions at DesignCon 2018 at booth 633. In response to the increase of generating data and infrastructure moving to the cloud, next-generation I/O and cabling solutions support faster processing, more bandwidth, increased density, and thermal management, while maximizing data flow efficiency and reliability in today’s data centers, according to Jairo Guerrero, the general manager at Molex.
The new compact Nano-Fit Power Connectors by Molex offer fully isolated headers in a 2.50 mm Pitch. Molex claims they are the smallest fully isolated terminal power connectors on the market—up to 69% smaller than competitive products. Fully protect your terminal headers and gain terminal position assurance with the new Molex connectors.
Molex, the American manufacturer of electrical, electronic, and fiber optic interconnection systems for a variety of industries, has recently introduced their Brad HarshIO Ethernet modules in order to offer a dependable solution for connecting industrial safety controllers to actuators and sensors in harsh duty environments. Molex Incorporated provides offerings for more than 100,000 products in the defense industry, aerospace industry, automotive industry, industrial automation industry, medical industry, as well as many more other industries.
The IEEE 2016 International Microwave Symposium (IMS) will be held in San Francisco, California, from May 22nd to May 27th at The Moscone Center. Here at this International Microwave Symposium, Molex will be presenting their diverse and innovative portfolio of RF/Microwave cable assemblies as well as connectors. Molex, the manufacturer of electronic, electrical, and fiber optic interconnection systems, will be displaying their portfolio in booth 1911. Molex designs, develops, and delivers integrated RF/Microwave solutions for a variety of industries, including medical, automotive, wireless, instrumentation, telecom, as well as defense and aerospace.
The new PCI Express 4.0 spec running at 16 Gbps per lane is being supported by the 2nd generation Optical Copper (Cu) Link interconnect system for inside and outside the box. Molex’s Nano Pitch connector and cable assembly system was selected by the PCI-SIG committee and is the option for the newly developing SAS 4.0 spec 24 Gbps per lane performance storage links. Internal cable assemblies, PCB receptacle connectors, shielded external cable assemblies and port receptacle connectors are nearing the final design and business case inputs by suppliers of tooling development. Some suppliers are expected to design their connector product to be able to support the next generation of PCI Express 5.0 which is running at 32 Gbps per lane for future proofing and reduction of development costs within the next few years.
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